Case Study Results

Showing 1-10 of 12 results
Automated Testing of Hardware-Dependent AUTOSAR MCAL software sine.ni.com/cs/app/doc/p/id/cs-17299
Developing a system for automated testing of peripheral software that does not require considerable investment into a specialized test hardware infrastructure and does not require continuous upgrading ...

Building a Software Automation Framework to Drive Standardization and Increase Efficiency in Semiconductor Post-Silicon Validation Engineering sine.ni.com/cs/app/doc/p/id/cs-17746
Establishing an effective mechanism to share measurement expertise and device, and instrumentation knowledge across validation teams to facilitate accelerated product development and validation cycles ...

Increasing Parallelism, Automation, and Standardization to Reduce Post-Silicon Characterization Time by Over 60% sine.ni.com/cs/app/doc/p/id/cs-17714
At Cypress Semiconductor Corp., we had to reduce the turnaround time for the bench characterization of diverse System-on-Chip (SoC) products designed and developed at different Cypress centers in Asia ...

Enabling Highly Effective Test Flows for Motion Sensor Test With PXI-Based ATE sine.ni.com/cs/app/doc/p/id/cs-17715
Chip-scale-packaging (CSP) technologies are gaining popularity for microelectromechanical systems (MEMS), but engineers with traditional test systems are challenged by the small size of the sensor and ...

High-Voltage, Time-Dependent Dielectric Breakdown System for the IEC 60747-17 Standard sine.ni.com/cs/app/doc/p/id/cs-17687
INTEK needed to invent and build a fully automatic measurement system that could test up to 50 magnetic couplers simultaneously while they are subjected to a high voltage (up to 8 kV rms) and placed in ...

Semiconductor Carrier Profiling at Sub-10 nm Lithography Nodes sine.ni.com/cs/app/doc/p/id/cs-17661
NewPath Research needed to develop a system for non-destructive, high-resolution carrier profiling with sub-nm resolution to support the semiconductor industry as it progresses to the new sub-10 nm lithography ...

Universal SRAM Test System Based on NI PXI Solutions sine.ni.com/cs/app/doc/p/id/cs-17592
We needed a turnkey solution for the functional test of static random access memories (SRAMs) that could support a wide range of memory models (more than 2,000). The solutions needed to be expandable, ...

Parametric Test for Next-Generation Semiconductor Technologies sine.ni.com/cs/app/doc/p/id/cs-17502
Performing accurate electrical wafer-level tests in the semiconductor R&D fabrication (fab) process flow to detect process-related issues at an early stage, which would help us to rework the wafers at ...

Paving the Way for Industry 4.0 With Smart, Reconfigurable Manufacturing Machines sine.ni.com/cs/app/doc/p/id/cs-17475
The Manufacturing Engineering Research Group at Trinity College Dublin needed to develop an open, reconfigurable, automated product test line that delivers Industry 4.0 capabilities and can test more than ...

Probing of Large-Array, Fine-Pitch Microbumps for 3D ICs sine.ni.com/cs/app/doc/p/id/cs-17384
Performing die tests prior to stacking 3D ICs to achieve sufficient compound stack yield by probing the interconnect microbumps for pre-bond test access.